Sn-Bi series low-temperature solder "LEO series"
Soldering at 200℃ is possible! Successfully commercialized low melting point alloys, achieving low-temperature mounting.
The "LEO Series" is a Sn-Bi based low-temperature solder suitable for mounting heat-sensitive components and substrates. It uses a low melting point alloy that allows soldering at 200°C, contributing to energy savings, reducing tip wear, and enabling the use of inexpensive materials, which is expected to lower material and manufacturing costs. The emergence of this repairable material accelerates low-temperature mounting using Sn-Bi in reflow ovens. 【Features】 ■ Suppresses the occurrence of splatter ■ Contributes to energy savings and reduces tip wear, leading to cost reduction ■ Allows for good soldering even at a tip temperature of 210°C ■ Development of low-temperature dedicated flux LEO shows good corrosion resistance and insulation properties *For more details, please refer to the PDF document or feel free to contact us.
- 企業:千住金属工業
- 価格:Other